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UV Nanosecond Laser Cutting Machine for Rigid PCB, Alumina Ceramic and Semiconductor Substrates
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UV Nanosecond Laser Cutting Machine for Rigid PCB | RFQ Sourcing Details

Laser Cutting Machines · Quote on request

This is a product procurement detail page: check specs, images, category context and related sourcing paths before sending an RFQ.

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Product specs

CategoryLaser Cutting Machines
Unitset
ModelCW-6050FZ/PZ/Z
StructureGantry type
Laser typeNanosecond UV pulse solid laser
Power supplyAC 380 V +10%, 50–60 Hz
Working area500 × 610 mm
Motion systemLinear-motor X/Y axes on marble platform
CategoryLaser Cutting Machines
AvailabilityInquiry required
Source date2026-07-23

Buyer's Digest

Use this page as a product-first sourcing checkpoint before sending an RFQ. Category: Laser Cutting Machines. Confirm application fit, capacity, materials, destination, lead time and compliance requirements before comparing suppliers.

Original product description

This UV nanosecond laser cutting machine is designed for precision processing of rigid PCB, alumina ceramic and semiconductor substrates. The listed application scope also includes cutting, drilling and etching work involving FPC, camera modules, PI and other polymer materials, tungsten steel and foil.

Because suitability can depend on the exact material grade, thickness, coating and required edge quality, buyers should confirm their intended process using representative samples before ordering. The machine uses a gantry structure with a marble-platform X/Y motion system driven by linear motors.

A high-pixel CCD visual auto-alignment system is included for workpiece positioning and alignment of small or irregular patterns. The stated working area is 500 × 610 mm, while an optional extra-large-field power listings are 10 W, 30 W and 35 W at a wavelength of 355 nm.

Published technical figures include positioning accuracy of ±1 μm, repeatability of 1 μm, processing accuracy of no more than 30 μm, processing speed of no more than 3,000 mm/s and a focus spot of no more than 20 μm.

These figures describe the offered equipment, but achievable production results should be validated against the buyer’s material, geometry, fixture, optical configuration and acceptance method. The system is water cooled and requires an AC 380 V supply with a stated tolerance of +10% at 50–60 Hz.

Overall machine dimensions are listed as 2,200 × 1,500 × 1,750 mm. A wooden transport case is specified. CE certification, a machinery test report and outgoing inspection video are listed as available.

For procurement review, buyers should confirm which model suffix and laser power are included in the quotation, whether the optional automation system or ted material thickness for the exact substrate, cycle-time expectations, utilities, site preparation, installation and training scope, consumables, spare-parts availability, delivery schedule and the written warranty exclusions.

The listed warranty period is 12 months, with overseas technical support available.

UV | Applications and Buyer Notes

UV is organized as a sourcing-ready Laser Cutting Machines reference. The page combines visible product or company data with structured procurement cues so buyers can compare application fit, specifications, quantity, quality requirements and lead-time questio

Applications

  • Initial shortlist building for related product or supplier options.
  • Specification and application fit review before bulk purchasing.
  • Category, keyword and detail-page comparison before sending an RFQ.

Key specifications

Category
Laser Cutting MachinesBased on visible page data; confirm exact value in the RFQ.
Unit
setBased on visible page data; confirm exact value in the RFQ.
Model
CW-6050FZ/PZ/ZBased on visible page data; confirm exact value in the RFQ.
Structure
Gantry typeBased on visible page data; confirm exact value in the RFQ.
Laser type
Nanosecond UV pulse solid laserBased on visible page data; confirm exact value in the RFQ.
Power supply
AC 380 V +10%, 50–60 HzBased on visible page data; confirm exact value in the RFQ.
Working area
500 × 610 mmBased on visible page data; confirm exact value in the RFQ.
Motion system
Linear-motor X/Y axes on marble platformBased on visible page data; confirm exact value in the RFQ.

Buyer tips

  • State quantity range and split-delivery needs before price comparison.
  • Add certification, material or inspection standards when they affect acceptance.
  • For time-sensitive projects, include target arrival date and destination.
  • For special applications, describe operating condition, installation environment and duty cycle.

FAQ

What should buyers confirm first?

Confirm application, specification, quantity, destination and lead-time requirements before comparing offers.

Can buyers inquire when specs are incomplete?

Yes. Add model, material, size, use case and inspection needs in the RFQ to make replies comparable.

How should this listing be evaluated?

Check title, category, specifications and related keywords against the actual sourcing requirement.

Source mix: ugc

Key specifications

CategoryLaser Cutting Machines
Unitset
ModelCW-6050FZ/PZ/Z
StructureGantry type
Laser typeNanosecond UV pulse solid laser
Power supplyAC 380 V +10%, 50–60 Hz
Working area500 × 610 mm
Motion systemLinear-motor X/Y axes on marble platform
Repeatability1 μm
Cooling systemWater c ing
Alignment systemCCD visual auto-alignment
Laser wavelength355 nm
Machine dimensions2,200 × 1,500 × 1,750 mm
Laser power options10 W / 30 W / 35 W
Applicable materialsRigid PCB, alumina ceramic and semiconductor substrates
Positioning accuracy±1 μm
Listed processing thickness3 mm

Product sourcing keywords

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