Zero Thermal Damage Femtosecond Laser Cutting Mac | RFQ Sourcing Details
Laser Cutting Machines · Quote on request
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Product specs
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Use this page as a product-first sourcing checkpoint before sending an RFQ. Category: Laser Cutting Machines. Confirm application fit, capacity, materials, destination, lead time and compliance requirements before comparing suppliers.
Original product description
. Overview Company Profile Packaging & Shipping After Sales Service Overview . Model NO.
CW-6050FZ/PZ/Z Application Aerospace Industry, Automotive Industry, Semiconductors/3c/Glass/Biomedical Cooling System Water Cooling Technical Class Pulse Laser Applicable Material Metal/Nonmetal Structure Type Gantry Type Laser Classification Solid Laser Laser Technology Laser Flame Cutting Laser Type Ultrafast Laser Laser Power 10W/30W/35W Working Area 500*610mm Positioning Accuracy ±1um Processing Speed ≤3000mm/S Processing Accuracy ≤30um Focus Spot ≤20um Scan Range of Galavanometer 50*50um Core Components Picosecond/Nanosecond/UV Machinery Test Report Provided Video Outgoing-Inspection Provided Certification CE Processing Thickness 3mm Processing Material UTG, Ceramics, Resins, Stone Materials, etc.
Power Supply Three-Phase 380V AC, 50. Hz, 60.
Hz 20A Transport Package Wooden Case Specification 2200*1500*1750mm Trademark CHANXAN Origin Suzhou Production Capacity 100sets/Month Femtosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan's UV Femtosecond laser machines are Tailored for micro-nano ultra-high precision, high-difficulty and high-value-added components, this equipment adopts 355nm ultraviolet short wavelength and femtosecond ultrashort pulse technology.
Equipped with an ultra-precision galvanometer system, heavy-duty constant-temperature marble frame, micron-level linear motor drive and high-definition CCD vision alignment system, it stably performs processes including ultra-micro hole drilling, ultra-narrow grooving, special-shaped cutting, precision etching and micro-nano structure fabrication.Adopting femtosecond pure cold processing, it causes zero thermal damage, ideal for ultra-thin, brittle and heat-sensitive special materials.
The UV laser enables nano-level ultra-fine machining with top-tier precision for forming various micro-nano precision structures. It is widely compatible with hard-to-process materials that conventional lasers struggle with, supporting stable mass production.
Machined surfaces feature smooth cross-sections free of burrs and chipping, eliminating post-processing and boosting yield rate. Featuring high working efficiency and industrial-grade durability, the machine supports 7×24-hour continuous production. Its in es.
Technical Specifications 1.Ultra-thin wafer dicing, SiC/GaN cutting for 3rd-generation semiconductors, chip micro-grooving, TSV deep hole etching, MEMS microstructure machining and sensor miniaturization.
The machined hole walls are smooth without chipping or lattice damage, fully complying with ultra-high cleanliness and precision requirements for the semiconductor industry.
2.Precision trimming for flexible OLED and MicroLED, ultra-micro hole drilling on ultra-thin glass and sapphire, ultra-fine circuit etching for FPC, cutting of ultra-thin PI films, and precision stripping of optical coating layers. No damage to base materials with perfectly smooth edges.
3.Ultra-micro hole drilling for minimally invasive catheters, precision cutting of vascular stents, microstructure machining for medical implants, fabrication of microfluidic chips and biosensors, as well as precision forming of medical polymer materials. No thermal burns, no chemical residues and no mechanical stress.
4.Ultra-fine grooving for lithium battery electrodes, nano-scale perforation on ultra-thin separators, etching of hydrogen fuel , and precision machining for new energy ceramic components. It eliminates microcracks and thermal deformation, improving product stability and service life.
5.Micro-nano machining for hard-to-process materials including diffractive optical elements, microlens arrays, infrared optical glass, quartz, ceramics, single-crystal materials, rare alloys and composite films.
Ideal for customized precision processing in aerospace, research institutes and high-end component manufacturing.
Laser power 10W/30W/35W Dimensions 2200*1500*1750mm Working area 500*610mm Certification CE Positioning Accuracy ±1um Machinery Test Report Provided processing speed ≤3000mm/s Video outgoing-inspection Provided processing accuracy ≤30um Warranty of core components 12 months Focus Spot ≤20um Applicable Industries Semiconductor/OLED/Glass/3C Scan range of galavanometer 50*50um Core Components Semiconductor pump source Company Profile CHANXAN (CHANGSHU) LASER TECHNOLOGY Co., Ltd.
1.CHANXAN FOUNDED IN 2012 2.National high-tech enterprise, owning 150 national patents, and participating in the formulation of industry standards.
3.Gazelle Enterprise, Technology-based Enterprise, Innovation-Based Enterprise, Suzhou Talent Enterprise, Purple Mountain Talent Enterprise, and partner of Fortune Global 500 Enterprises.
4.80,000 square meters of production factories;five major R&D, production, and sales bases in Changshu, Suzhou, Nanjing, Guangdong, and Vietnam. 5.Supplier of laser engraving equipment for the 2022 Winter Olympics torch;****** Super Factory in 2021;recommended by Suzhou municipal government.
6.More than 100 offices and agents domestic and abroad, including factories and service centers in both South and North Vietnam. 7.Products have good sales in more than 100 countries, providing high-quality equipment and efficient services to countless industrial customers from all over the world. Why Choose Us?
Service Commitment We have achieved full-process digitalization of after-sales service, providing customers with professional and efficient after-sales support via the Service helping them create greater benefits. We strictly adhere to the ISO9001: 2015 international quality management system standard.
With the spirit of striving for excellence, we are committed to manufacturing superior quality products for our customers. A nationwide(China) toll-free service hotline is available for 24 hours, and a professional service team responds quickly 24 hours a day to effectively .
Invention Patent As a leader in the laser technology field, Chanxan has acquired 150 national patents and successfully established two independent brands.
The company has not only established a strict enterprise product quality standard system with comprehensive filing to the quality supervision department, but has also deeply participated in the formulation of multiple industry standards as an industry pioneer. To strengthen its R&D and ser
Zero | Applications and Buyer Notes
Zero is organized as a sourcing-ready Laser Cutting Machines reference. The page combines visible product or company data with structured procurement cues so buyers can compare application fit, specifications, quantity, quality requirements and lead-time quest
Applications
- Initial shortlist building for related product or supplier options.
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- Category, keyword and detail-page comparison before sending an RFQ.
Key specifications
- Category
- Laser Cutting MachinesBased on visible page data; confirm exact value in the RFQ.
- Unit
- setBased on visible page data; confirm exact value in the RFQ.
- Type
- Ultrafast Laser LaserBased on visible page data; confirm exact value in the RFQ.
- Power
- Supply Three-Phase 380V AC, 50Hz, 60Hz 20ABased on visible page data; confirm exact value in the RFQ.
- Origin
- SuzhouBased on visible page data; confirm exact value in the RFQ.
- Material
- UTG, Ceramics, Resins, Stone Materials, etcBased on visible page data; confirm exact value in the RFQ.
- Warranty
- 12 MonthsBased on visible page data; confirm exact value in the RFQ.
- Model NO.
- CW-6050FZ/PZ/ZBased on visible page data; confirm exact value in the RFQ.
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