Fine Grain Ceramic IC Test Socket Laser Cutting M | RFQ Sourcing Details

. Overview Company Profile Packaging & Shipping After Sales Service Overview . Model NO.

CW-6050FZ/PZ/Z Application Aerospace Industry, Automotive Industry, Semiconductors/3c Cooling System Water Cooling Technical Class Pulse Laser Applicable Material Nonmetal Structure Type Gantry Type Laser Classification Solid Laser Laser Technology Laser Flame Cutting Laser Type Ultrafast Laser Laser Power 30W Working Area 500*610mm Positioning Accuracy ±1um Processing Speed ≤3000mm/S Processing Accuracy ≤30um Focus Spot ≤20um Scan Range of Galavanometer 50*50um Machinery Test Report Provided Video Outgoing-Inspection Provided Certification CE Processing Thickness 3mm Processing Material BGA/LGA/Csp/Qfp/Qfn/Ssop/FM/Tpspcr/ Power Supply AC 380V+10%, 50~60.

Hz Transport Package Wooden Case Specification 2200*1500*1750mm Trademark CHANXAN Origin Suzhou Production Capacity 100sets/Month UV Picosecond Laser Cutting Machine(UV/IR/Green Light) Chanxan provides UV picosecond laser cutting machines can accura such as ceramic bases, probe board micropores, shielding structures, etc., achieving micrometer level cutting accuracy and minimal heat affected zone.The "behind the scenes quality inspector" of semiconductor chips - IC Test Socket.

After the chip is packaged, the equipment must be powered by these precision components and tested for functionality to screen out defective products.

Equipment Advantages 1.BGA/LGA test seat ceramic base processing For Al2O3 or aluminum nitride ceramic bases, UV picosecond laser can complete contour cutting and positioning groove processing with a positioning accuracy of ± 2 μ m.

The heat affected zone is controlled within 5 μ m, effectively avoiding brittle material cracking and ensuring long-term insertion and removal reliability. 2.Micropore forming of high-density probe plate (Pogo Pin Plate) In BGA test sockets, hundreds of through holes with a diameter of 50-200 μ m need to be processed.

The Chuangxuan equipment adopts a 5 μ m focused spot and a high repetition rate laser to achieve smooth and burr free hole walls, support fine graphic processing with a line width of ≤ 30 μ m, and significantly improve .

3.QFN/WLCSP test seat shielding slot cutting In response to the problem of high-frequency signal interference, UV picosecond laser can accura ure signal integrity, and is suitable for 5G communication and AI chip testing scenarios.

Key Configurations 1.The positioning accuracy is ± 1 μ m, the processing accuracy is ≤ 30 μ m, and the minimum focused spot can reach 3-5 μ m, suitable for micro nano processing. 2.Marble platform+linear motor drive: maintains high stability and high repeatability accuracy even during high-speed operation (≤ 3000mm/s).

3.High pixel CCD automatic alignment: precise visual positioning, suitable for cutting precision workpieces such as FPC and PCB. Technical Specifications 1.With a focused spot size as small as a few microns, the machine achieves ±1μm positioning accuracy and 1μm repeatability.

It excels in micro-cutting, drilling, and patterning tasks, meeting the strictest tolerances of 3C electronics, semiconductor, and aerospace industries.

2.For high-temperature resistant components such as PEEK and ceramic reinforced composite materials, a "cold peeling" mechanism is used for non- , maintain the integrity of material mechanical properties, and meet the requirements of automotive grade aging testing.

3.Supports importing multiple formats such as DSP, DXF, AI, etc., combined with a high-precision CCD automatic alignment system, to achieve flexible production of multiple varieties and small batches, shortening the development cycle by more than 30%.

Laser power 30W Dimensions 2200*1500*1750mm Working area 500*610mm Certification CE Positioning Accuracy ±1um Machinery Test Report Provided processing speed ≤3000mm/s Video outgoing-inspection Provided processing accuracy ≤30um Warranty of core components 12 Months Focus Spot ≤20um Applicable Industries Semiconductor/3C Scan range of galavanometer 50*50um Core Components Semiconductor Pump Source Company Profile CHANXAN (CHANGSHU) LASER TECHNOLOGY Co., Ltd.

1.CHANXAN FOUNDED IN 2012 2.National high-tech enterprise, owning 150 national patents, and participating in the formulation of industry standards.

3.Gazelle Enterprise, Technology-based Enterprise, Innovation-Based Enterprise, Suzhou Talent Enterprise, Purple Mountain Talent Enterprise, and partner of Fortune Global 500 Enterprises.

4.80,000 square meters of production factories;five major R&D, production, and sales bases in Changshu, Suzhou, Nanjing, Guangdong, and Vietnam. 5.Supplier of laser engraving equipment for the 2022 Winter Olympics torch;****** Super Factory in 2021;recommended by Suzhou municipal government.

6.More than 100 offices and agents domestic and abroad, including factories and service centers in both South and North Vietnam. 7.Products have good sales in more than 100 countries, providing high-quality equipment and efficient services to countless industrial customers from all over the world. Why Choose Us?

Service Commitment We have achieved full-process digitalization of after-sales service, providing customers with professional and efficient after-sales support via the Service helping them create greater benefits. We strictly adhere to the ISO9001: 2015 international quality management system standard.

With the spirit of striving for excellence, we are committed to manufacturing superior quality products for our customers. A nationwide(China) toll-free service hotline is available for 24 hours, and a professional service team responds quickly 24 hours a day to effectively .

Invention Patent As a leader in the laser technology field, Chanxan has acquired 150 national patents and successfully established two independent brands.

The company has not only established a strict enterprise product quality standard system with comprehensive filing to the quality supervision department, but has also deeply participated in the formulation of multiple industry standards as an industry pioneer. To strengthen its R&D and service cap